Open AccessCorrection: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
Author(s) -
Gan Chong Leong,
U. Hashim
Publication year - 2014
Publication title -
plos one
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.99
H-Index - 332
ISSN - 1932-6203
DOI - 10.1371/annotation/21a4e441-0c3f-4319-9833-91d316b99d43
Subject(s) - intermetallic , materials science , wire bonding , ball grid array , microelectronics , doping , palladium , temperature cycling , composite material , soldering , nanotechnology , alloy , optoelectronics , electrical engineering , chemistry , thermodynamics , chip , biochemistry , physics , engineering , catalysis , thermal