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Compact 3D angle sensor
Author(s) -
Wenran Ren,
Jiwen Cui,
Jiubin Tan
Publication year - 2019
Publication title -
osa continuum
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 8
ISSN - 2578-7519
DOI - 10.1364/osac.2.002650
Subject(s) - computer science , materials science

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