Open AccessFiber-to-chip fusion splicing for low-loss photonic packaging
Author(s) -
Juniyali Nauriyal,
Meiting Song,
R. Yu,
Jaime Cárdenas
Publication year - 2019
Publication title -
optica
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 5.074
H-Index - 107
ISSN - 2334-2536
DOI - 10.1364/optica.6.000549
Subject(s) - fusion splicing , coupling loss , materials science , chip , photonics , optical fiber , optoelectronics , silicon photonics , plastic optical fiber , computer science , multi mode optical fiber , telecommunications
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