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Improved power conversion efficiency in high-performance photodiodes by flip-chip bonding on diamond
Author(s) -
Xiaojun Xie,
Qiugui Zhou,
Kejia Li,
Yang Shen,
Qinglong Li,
Zhanyu Yang,
Andréas Beling,
Joe C. Campbell
Publication year - 2014
Publication title -
optica
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.074
H-Index - 107
ISSN - 2334-2536
DOI - 10.1364/optica.1.000429
Subject(s) - dbm , photodiode , optoelectronics , materials science , diamond , microwave , energy conversion efficiency , flip chip , photonics , radio frequency , power (physics) , electrical engineering , amplifier , physics , telecommunications , nanotechnology , engineering , cmos , adhesive , layer (electronics) , quantum mechanics , composite material

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