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Improved power conversion efficiency in high-performance photodiodes by flip-chip bonding on diamond
Author(s) -
Xiaojun Xie,
Qiugui Zhou,
Kejia Li,
Yang Shen,
Qinglong Li,
Zhengming Yang,
Andreas Beling,
Joe C. Campbell
Publication year - 2014
Publication title -
optica
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.074
H-Index - 107
ISSN - 2334-2536
DOI - 10.1364/optica.1.000429
Subject(s) - flip chip , photodiode , materials science , optoelectronics , diamond , power (physics) , chip , flip , electrical engineering , nanotechnology , engineering , chemistry , physics , composite material , adhesive , layer (electronics) , quantum mechanics , apoptosis , biochemistry

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