Open Access4H-SiC wafer slicing by using femtosecond laser double-pulses
Author(s) -
Eunho Kim,
Yasuhiko Shimotsuma,
Masaaki Sakakura,
Kiyotaka Miura
Publication year - 2017
Publication title -
optical materials express
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.925
H-Index - 66
ISSN - 2159-3930
DOI - 10.1364/ome.7.002450
Subject(s) - materials science , wafer , femtosecond , silicon carbide , wafer dicing , slicing , optoelectronics , surface roughness , laser , crystal (programming language) , optics , composite material , physics , computer science , engineering , mechanical engineering , programming language
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