Open Access4H-SiC wafer slicing by using femtosecond laser double-pulses
Author(s) -
EunHo Kim,
Yasuhiko Shimotsuma,
Masaaki Sakakura,
Kiyotaka Miura
Publication year - 2017
Publication title -
optical materials express
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.925
H-Index - 66
ISSN - 2159-3930
DOI - 10.1364/ome.7.002450
Subject(s) - materials science , slicing , femtosecond , wafer , optoelectronics , laser , optics , materials processing , computer science , physics , engineering , world wide web , manufacturing engineering