Open AccessSpatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing
Author(s) -
Dimitars Jevtics,
Jack A. Smith,
John McPhillimy,
Benoit Guilhabert,
Paul Hill,
Charalambos Klitis,
Antonio Hurtado,
Marc Sorel,
Hark Hoe Tan,
Chennupati Jagadish,
Martin D. Dawson,
Michael J. Strain
Publication year - 2021
Publication title -
optical materials express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.925
H-Index - 66
ISSN - 2159-3930
DOI - 10.1364/ome.432751
Subject(s) - transfer printing , materials science , optoelectronics , chip , footprint , resonator , nanowire , waveguide , semiconductor device , wafer scale integration , semiconductor , nanotechnology , wafer , layer (electronics) , computer science , composite material , biology , paleontology , telecommunications