Micro-ablation with high power pulsed copper vapor lasers | Zendy

M. R. H. Knowles | Zendy

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Micro-ablation with high power pulsed copper vapor lasers

Author(s) -

M. R. H. Knowles

Publication year - 2000

Publication title -

optics express

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 1.394

H-Index - 271

ISSN - 1094-4087

DOI - 10.1364/oe.7.000050

Subject(s) - materials science , nanosecond , laser , laser drilling , optics , laser beam machining , machining , ablation , optoelectronics , laser ablation , laser beams , physics , engineering , metallurgy , aerospace engineering

Visible and UV lasers with nanosecond pulse durations, diffraction-limited beam quality and high pulse repetition rates have demonstrated micro-ablation in a wide variety of materials with sub-micron precision and sub-micron-sized heat-affected zones. The copper vapour laser (CVL) is one of the important industrial lasers for micro-ablation applications. Manufacturing applications for the CVL include orifice drilling in fuel injection components and inkjet printers, micro-milling of micromoulds, via hole drilling in printed circuit boards and silicon machining. Recent advances in higher power (100W visible, 5W UV), diffraction-limited, compact CVLs are opening new possibilities for manufacturing with this class of nanosecond laser.

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