Open AccessCrack barriers for thick SiN using dicing
Author(s) -
Ruben Grootes,
Meindert Dijkstra,
Yvan Klaver,
David Marpaung,
Herman L. Offerhaus
Publication year - 2022
Publication title -
optics express
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.456834
Subject(s) - wafer dicing , materials science , wafer , chemical vapor deposition , optics , resonator , dispersion (optics) , silicon nitride , composite material , optoelectronics , silicon , physics