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Channel waveguide lasers in bulk Tm:LiYF4 produced by deep diamond-saw dicing
Author(s) -
Pavel Loiko,
Ludovic GauthierManuel,
Gurvan Brasse,
Esrom Kifle,
Lauren Guillemot,
Alain Braud,
Abdelmjid Benayad,
V. Ménard,
Patrice Camy
Publication year - 2020
Publication title -
optics express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.400497
Subject(s) - wafer dicing , materials science , laser , optics , diamond , crystal (programming language) , optoelectronics , wafer , physics , computer science , composite material , programming language
We report on a novel approach to fabricate channel (ridge) waveguides (WGs) in bulk crystals using precision diamond saw dicing. The channels feature a high depth-to-width aspect ratio (deep dicing). The proof-of-the-concept is shown for a Tm 3+ :LiYF 4 fluoride crystal. Channels with a depth of 200 µm and widths of 10-50 µm are diced and characterized by confocal laser microscopy revealing a r.m.s. roughness of the walls well below 100 nm. The channels obtained possess waveguiding properties at ∼815 nm with almost no leakage of the guided mode having a vertical stripe intensity profile into the bulk crystal volume and relatively low propagation losses (0.20-0.43 dB/cm). Laser operation is achieved in quasi-CW regime by pumping at 780 nm. The maximum peak output power reaches 0.68 W at ∼1.91 µm with a slope efficiency of 53.3% (in σ-polarization). The proposed concept is applicable to a variety of laser crystals with different rare-earth dopants.

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