Design of double-slot antennas for terahertz array detectors in flip chip packaging

In flip chip packaging, the performance of terahertz (THz) array detectors is directly influenced by the flip chip. In addition, predicting this effect is difficult because the readout circuits in the flip chip are very complex. In this study, to reduce the influence of the flip chip, we design a new type of double-slot antennas for THz array detectors. For comparison, we designed and analyzed dipole antennas with the same period. Numerical simulations showed that the coupling efficiency of the double-slot array antennas at approximately 0.6255 THz does not degrade, if the flip chip structure is changed. However, in the case of dipole array antennas with the same period of 250 µm, coupling efficiency was severely affected by the flip chip structure. These results revealed that double-slot antennas are more applicable to THz array detectors compared with dipole antennas, as they can more effectively reduce the influence of the flip chip. Furthermore, we integrated the double-slot antennas into Nb 5 N 6 THz array detectors using the micro-fabrication technology. Measurement results indicated that double-slot antennas possess the advantages of facile preparation and large-scale integration, which provide great potential for THz array detectors in flip chip packaging.