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Gas shrinking laminar flow for robust high-power waterjet laser processing technology
Author(s) -
Guangyi Zhang,
Zheng Zhang,
Yufeng Wang,
Caixia Guo,
Wenwu Zhang
Publication year - 2019
Publication title -
optics express
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.378328
Subject(s) - laminar flow , materials science , laser , optics , offset (computer science) , laser power scaling , mechanics , computer science , physics , programming language
At present, waterjet-assisted laser processing technologies are disadvantaged by low coupling power and poor process reliability, which significantly affect processing efficiency and depth. To address these shortcomings, we propose herein a novel water-gas shrinkage-guided high-power laser processing (WSLP) technology. Firstly, the characteristics of the laminar flow and the light guiding of the water-gas coupled device are optimized. The laminar simulation results show that the water-gas contraction ratio and laminar flow length can be adjusted by changing the water/gas pressure and structural parameters. Secondly, light guiding simulation reveals with a 532 nm 1000W laser, the light guiding efficiency of the shrinkage interface can reach more than 95% within the range of the axial offset 22.1 mm, radial offset 0.62 mm and angular offset 15.8° of the laser focus. Compared with the traditional waterjet-assisted laser processing method, the anti-disturbance capability of the WSLP method is increased by 3.8 times in the axial direction, 2.3 times in the radial direction, and 1.5 times in the angle offset. Thirdly, the feasibility of the laser conduction and processing with this water-gas shrinkage method is verified by experiments. The formation conditions and the relationship of the water-gas laminar flow are investigated. The result shows that the laser coupling efficiency can reach 93% in the low power condition. The research can provide technical support for large depth laser precision machining, in the future.

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