Watt-level Tm:LiYF4 channel waveguide laser produced by diamond saw dicing
Author(s) -
Pavel Loiko,
Rémi Soulard,
Gurvan Brasse,
JeanLouis Doualan,
Blandine Guichardaz,
Alain Braud,
Aleksey Tyazhev,
Ammar Hideur,
Patrice Camy
Publication year - 2018
Publication title -
optics express
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.26.024653
Subject(s) - wafer dicing , materials science , laser , sapphire , optics , diamond , epitaxy , optoelectronics , waveguide , continuous wave , femtosecond , amplifier , surface roughness , wafer , nanotechnology , physics , cmos , layer (electronics) , composite material
Low-loss surface channel waveguides with a cross-section of 30 × 30 μm 2 are produced by diamond saw dicing of 6.2 at.% Tm 3+ , 3.5 at.% Gd 3+ :LiYF 4 films grown by liquid phase epitaxy (LPE) on (001)-oriented bulk undoped LiYF 4 substrates. Pumped by a Ti:Sapphire laser at 783 nm, a continuous-wave Tm:LiYF 4 waveguide laser generated 1.30 W at 1880 nm (for π-polarization) with a slope efficiency of 80% with respect to the absorbed pump power. The laser threshold was at 80 mW. The waveguide morphology was studied revealing low roughness (3 ± 2 μm) as expressed by the propagation losses of <0.3 dB/cm. A combination of LPE and diamond saw dicing is a promising technology for multi-watt single-mode channel waveguide lasers and amplifiers.
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom