Open AccessNovel orthogonal velocity polishing tool and its material removal characteristics from CVD SiC mirror surfaces
Author(s) -
Hyunju Seo,
Jeong Yeol Han,
Sug Whan Kim,
Sehyun Seong,
Siyoung Yoon,
Kyoung-Muk Lee,
Jinsuk Hong,
Haeng-Bok Lee,
Mingab Bok
Publication year - 2016
Publication title -
optics express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.24.012349
Subject(s) - polishing , dwell time , materials science , silicon carbide , optics , chemical vapor deposition , gaussian , composite material , mechanical engineering , physics , optoelectronics , medicine , clinical psychology , quantum mechanics , engineering
A new and patented polishing tool called Orthogonal Velocity field Tool (OVT) was built and its material removal characteristics from Chemical Vapor Deposition Silicon Carbide (CVD SiC) mirror surfaces were investigated in this study. The velocity field of OVT is produced by rotating the bicycle type tool in the two orthogonal axes, and this concept is capable of producing a material removal foot print of pseudo Gaussian shapes. First for the OVT characterization, we derived a theoretical material removal model using distributions of pressure exerted onto the workpiece surface, relative speed between the tool and workpiece surface, and dwell time inside the tool- workpiece contact area. Second, using two flat CVD SiC mirrors that are 150 mm in diameter, we ran material removal experiments over machine run parameter ranging from 12.901 to 25.867 psi in pressure, from 0.086 m/sec to 0.147 m/sec tool in the relative speed, and 5 to 15 sec in dwell time. Material removal coefficients are obtained by using the in-house developed data analysis program. The resulting material removal coefficient varies from 3.35 to 9.46 um/psi hour m/sec with a mean value of 5.90 ± 1.26(standard deviation). We describe the technical details of the new OVT machine, the data analysis program, the experiments, and the results together with the implications to the future development of the machine.