Open AccessPr-based metallic glass films used as resist for phase-change lithography
Author(s) -
Teng Luo,
Zhen Li,
Qingping He,
Xiangshui Miao
Publication year - 2016
Publication title -
optics express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.24.005754
Subject(s) - resist , materials science , lithography , optics , etching (microfabrication) , phase (matter) , photolithography , laser , thin film , photoresist , x ray lithography , optoelectronics , nanotechnology , chemistry , physics , organic chemistry , layer (electronics)
Metallic glass film of Pr 60 Al 10 Ni 10 Cu 20 is proposed to be used as a resist of phase-change lithography (PCL). PCL is a mask-less lithography technology by using laser-direct-writing to create the intended nanopatterns. Thermal distribution in the PrAlNiCu film after exposure is calculated by finite element method (FEM). Thin films are exposed by continuous-wave laser and selective etched by nitric-acid solution, and the patterns are discerned by optical and atomic force microscope. The etching rate of as-deposited PrAlNiCu is thus nearly five times of the crystalline film. These results indicate that PrAlNiCu metallic glass film is a promising resist for phase-change lithography.