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Chip-based silica microspheres for cavity optomechanics
Author(s) -
Xuefeng Jiang,
Min Wang,
Mark C. Kuzyk,
Thein Oo,
GuiLu Long,
Hailin Wang
Publication year - 2015
Publication title -
optics express
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.23.027260
Subject(s) - optomechanics , materials science , wafer , chip , microsphere , optoelectronics , optics , bistability , silicon , optical fiber , nanotechnology , resonator , physics , chemical engineering , electrical engineering , engineering
We have experimentally realized on-chip silica microspheres that feature excellent thermal coupling to the silicon wafer. The chip-based microspheres significantly reduce laser-induced heating and correspondingly exhibit much lower threshold optical power for heating-induced optical bistability. We also show that the chip-based microspheres have optical and especially optomechanical properties that are similar to those of traditional fiber-stem-attached silica microspheres, making the chip-based microspheres suitable for optomechanical studies in a vacuum environment.

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