An all-solid-state, WDM silicon photonic digital link for chip-to-chip communications | Zendy

Hiren Thacker | Zendy; Xuezhe Zheng | Zendy; Jon Lexau | Zendy; Roshanak Shafiiha | Zendy; Ivan Shubin | Zendy; Shiyun Lin | Zendy; Stevan S. Djordjevic | Zendy; Philip Amberg | Zendy; Eric Chang | Zendy; Frankie Liu | Zendy; John C. Simons | Zendy; Jin-Hyoung Lee | Zendy; Arin Abed | Zendy; Hong Liang | Zendy; Ying Luo | Zendy; Jin Yao | Zendy; Dazeng Feng | Zendy; Mehdi Asghari | Zendy; Ron Ho | Zendy; Kannan Raj | Zendy; J. E. Cunningham | Zendy; Ashok V. Krishnamoorthy | Zendy

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An all-solid-state, WDM silicon photonic digital link for chip-to-chip communications

Author(s) -

Hiren Thacker,

Xuezhe Zheng,

Jon Lexau,

Roshanak Shafiiha,

Ivan Shubin,

Shiyun Lin,

Stevan S. Djordjevic,

Philip Amberg,

Eric Chang,

Frankie Liu,

John C. Simons,

Jin-Hyoung Lee,

Arin Abed,

Hong Liang,

Ying Luo,

Jin Yao,

Dazeng Feng,

Mehdi Asghari,

Ron Ho,

Kannan Raj,

J. E. Cunningham,

Ashok V. Krishnamoorthy

Publication year - 2015

Publication title -

optics express

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 1.394

H-Index - 271

ISSN - 1094-4087

DOI - 10.1364/oe.23.012808

Subject(s) - wavelength division multiplexing , silicon photonics , silicon on insulator , optics , chip , optoelectronics , multiplexing , waveguide , photonics , materials science , photonic integrated circuit , optical link , silicon , computer science , wavelength , physics , telecommunications , optical fiber

We describe a multiwavelength hybrid-integrated solid-state link on a 3 µm silicon-on-insulator (SOI) nanophotonic platform. The link spans three chips and employs germanium-silicon electroabsorption waveguide modulators, silicon transport waveguides, echelle gratings for multiplexing and demultiplexing, and pure germanium waveguide photo-detectors. The 8λ WDM Tx and Rx components are interconnected via a routing "bridge" chip using edge-coupled optical proximity communication. The packaged, retimed digital WDM link is demonstrated at 10 Gb/s and 10(-12) BER, with three wavelength channels consuming an on-chip power below 1.5 pJ/bit, excluding the external laser power.

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