Open AccessAn all-solid-state, WDM silicon photonic digital link for chip-to-chip communications
Author(s) -
Hiren Thacker,
Xuezhe Zheng,
Jon Lexau,
Roshanak Shafiiha,
Ivan Shubin,
Shiwei Lin,
Stevan S. Djordjevic,
Philip Amberg,
Eric Y. Chang,
Frankie Liu,
John C. Simons,
Jinhyoung Lee,
Arin Abed,
Hong Liang,
Ying Luo,
Jin Yao,
Dazeng Feng,
Mehdi Asghari,
Ron Ho,
Kannan Raj,
J. E. Cunningham,
Ashok V. Krishnamoorthy
Publication year - 2015
Publication title -
optics express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.23.012808
Subject(s) - wavelength division multiplexing , silicon on insulator , silicon photonics , optics , optoelectronics , multiplexing , chip , waveguide , materials science , photonics , photonic integrated circuit , optical link , silicon , computer science , wavelength , physics , telecommunications , optical fiber
We describe a multiwavelength hybrid-integrated solid-state link on a 3 µm silicon-on-insulator (SOI) nanophotonic platform. The link spans three chips and employs germanium-silicon electroabsorption waveguide modulators, silicon transport waveguides, echelle gratings for multiplexing and demultiplexing, and pure germanium waveguide photo-detectors. The 8λ WDM Tx and Rx components are interconnected via a routing "bridge" chip using edge-coupled optical proximity communication. The packaged, retimed digital WDM link is demonstrated at 10 Gb/s and 10(-12) BER, with three wavelength channels consuming an on-chip power below 1.5 pJ/bit, excluding the external laser power.