
High speed, high strength microwelding of Si/glass using ps-laser pulses
Author(s) -
Isamu Miyamoto,
Yasuhiro Okamoto,
Assi Hansen,
Jorma Vihinen,
Tiina Amberla,
Jarno Kangastupa
Publication year - 2015
Publication title -
optics express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.23.003427
Subject(s) - materials science , borosilicate glass , laser , welding , optics , wafer , laser beam welding , composite material , optoelectronics , physics
A novel microwelding procedure to join Si-to-glass using ps-laser pulses with high repetition rates is presented. The procedure provides weld joint with mechanical strength as high as 85 MPa and 45 MPa in sample pairs of Si/aluminosilicate (Si/SW-Y) and Si/borosilicate (Si/Borofloat 33), respectively, which are higher than anodic bonding, at high spatial resolution (< 20 µm) and very high throughput without pre- and post-heating. Laser-matter interaction analysis indicates that excellent weld joint of Si/glass is obtained by avoiding violent evaporation of Si substrate using ps-laser pulses. Laser welded Si/glass samples can be singulated along the weld lines by standard blade dicer without defects, demonstrating welding by ps-laser pulses is applicable to wafer-level packaging.