Open AccessDry-film polymer waveguide for silicon photonics chip packaging
Author(s) -
Hsiang-Han Hsu,
Shigeru Nakagawa
Publication year - 2014
Publication title -
optics express
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.22.023379
Subject(s) - waveguide , materials science , silicon photonics , photonics , silicon , coupling loss , polymer , optics , chip , optoelectronics , coupling (piping) , optical fiber , telecommunications , composite material , physics , computer science
Polymer waveguide made by dry film process is demonstrated for silicon photonics chip packaging. With 8 μm × 11.5 μm core waveguide, little penalty is observed up to 25 Gbps before or after the light propagate through a 10-km long single-mode fiber (SMF). Coupling loss to SMF is 0.24 dB and 1.31 dB at the polymer waveguide input and output ends, respectively. Alignment tolerance for 0.5 dB loss increase is +/- 1.0 μm along both vertical and horizontal directions for the coupling from the polymer waveguide to SMF. The dry-film polymer waveguide demonstrates promising performance for silicon photonics chip packaging used in next generation optical multi-chip module.