Open AccessHydrogenated amorphous silicon photonic device trimming by UV-irradiation
Author(s) -
T. Lipka,
Melanie Kiepsch,
Hoc Khiem Trieu,
Jörg Müller
Publication year - 2014
Publication title -
optics express
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.22.012122
Subject(s) - trimming , materials science , free spectral range , photonics , optoelectronics , fabrication , astronomical interferometer , photonic integrated circuit , optics , resonator , wafer , lithography , silicon photonics , silicon , interferometry , computer science , physics , medicine , alternative medicine , pathology , operating system
A method to compensate for fabrication tolerances and to fine-tune individual photonic circuit components is inevitable for wafer-scale photonic systems even with most-advanced CMOS-fabrication tools. We report a cost-effective and highly accurate method for the permanent trimming of hydrogenated amorphous silicon photonic devices by UV-irradiation. Microring resonators and Mach-Zehnder-interferometers were utilized as photonic test devices. The MZIs were tuned forth and back over their complete free spectral range of 5.5 nm by locally trimming the two MZI-arms. The trimming range exceeds 8 nm for compact ring resonators with trimming accuracies of 20 pm. Trimming speeds of ≥ 10 GHz/s were achieved. The components did not show any substantial device degradation.