Open AccessFlip-chip optical couplers with scalable I/O count for silicon photonics
Author(s) -
İbrahim Murat Soğancı,
Antonio La Porta,
Bert Jan Offrein
Publication year - 2013
Publication title -
optics express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.21.016075
Subject(s) - materials science , silicon photonics , optics , silicon , optoelectronics , coupling loss , photonics , silicon on insulator , insertion loss , waveguide , polarization (electrochemistry) , offset (computer science) , planar , photonic integrated circuit , optical fiber , physics , chemistry , computer graphics (images) , computer science , programming language
A scalable and tolerant optical interfacing method based on flip-chip bonding is developed for silicon photonics packaging. Bidirectional optical couplers between multiple silicon-on-insulator waveguides and single-mode polymer waveguides are designed and fabricated. Successful operation is verified experimentally in the 1530-1570 nm spectral window. At the wavelength of 1570 nm, the coupling loss is as low as 0.8 dB for both polarization states and the planar misalignment loss is less than 0.6 dB for TE and 0.3 dB for TM polarization in a lateral silicon-polymer waveguide offset range of ± 2 µm. The coupling loss does not exhibit any temperature dependence up to the highest measurement point of 70°C.