Open AccessHigh-output-power, single-wavelength silicon hybrid laser using precise flip-chip bonding technology
Author(s) -
Shinsuke Tanaka,
Seok−Hwan Jeong,
Satoshi Sekiguchi,
T. Kurahashi,
Yu Tao,
Ken Morito
Publication year - 2012
Publication title -
optics express
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.20.028057
Subject(s) - materials science , optoelectronics , laser , optics , longitudinal mode , lasing threshold , flip chip , silicon , chip , wavelength , electrical engineering , physics , adhesive , layer (electronics) , composite material , engineering
An Si/III-V hybrid laser oscillating at a single wavelength was developed for use in a large-scale Si optical I/O chip. The laser had an InP-based reflective semiconductor optical amplifier (SOA) chip integrated with an Si wavelength-selection-mirror chip in a flip-chip configuration. A low coupling loss of 1.55 dB at the Si-SOA interface was accomplished by both mode-field-matching between Si-SOA waveguides and accurately controlling the bonding position. The fabricated Si hybrid laser exhibited a very low threshold current of 9.4 mA, a high output power of 15.0 mW, and a high wall-plug efficiency of 7.6% at 20 °C. Moreover, the device maintained a high output power of >10 mW up to 60°C due to the high thermal conductance between the SOA chip and Si substrate. The short cavity length of the flip-chip bonded laser expanded the longitudinal mode spacing. This resulted in temperature-stable single longitudinal mode lasing and a low RIN level of <-130 dB/Hz.