Open AccessFirst demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate
Author(s) -
Yutaka Urino,
Takanori Shimizu,
Makoto Okano,
Nobuaki Hatori,
Masashige Ishizaka,
Tsuyoshi Yamamoto,
Toshihide Baba,
Takeshi Akagawa,
Suguru Akiyama,
Tatsuya Usuki,
Daisuke Okamoto,
Makoto Miura,
Masataka Noguchi,
Junichi Fujikata,
Daisuke Shimura,
Hideaki Okayama,
Tai Tsuchizawa,
T. Watanabe,
Koji Yamada,
S. Itabashi,
Emiko Saito,
Takahiro Nakamura,
Yasuhiko Arakawa
Publication year - 2011
Publication title -
optics express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.19.00b159
Subject(s) - silicon photonics , optoelectronics , materials science , photodetector , photonics , laser , silicon , bottleneck , hybrid silicon laser , photonic integrated circuit , bandwidth (computing) , optical communication , transmission (telecommunications) , optics , computer science , telecommunications , physics , embedded system
Engineers are currently facing some technical issues in support of the exponential performance growths in information industries. One of the most serious issues is a bottleneck of inter-chip interconnects. We propose a new "Photonics-Electronics Convergence System" concept. High density optical interconnects integrated with a 13-channel arrayed laser diode, silicon optical modulators, germanium photodetectors, and silicon optical waveguides on single silicon substrate were demonstrated for the first time using this system. A 5-Gbps error free data transmission and a 3.5-Tbps/cm(2) transmission density were achieved. We believe that this technology will solve the bandwidth bottleneck problem among LSI chips in the future.