Open AccessThickness and refractive index measurement of a silicon wafer based on an optical comb
Author(s) -
Jonghan Jin,
Jae Wan Kim,
Chu-Shik Kang,
Jong-Ahn Kim,
Tae Bong Eom
Publication year - 2010
Publication title -
optics express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.18.018339
Subject(s) - refractive index , wafer , optics , materials science , silicon , phase (matter) , optoelectronics , physics , quantum mechanics
We have proposed and demonstrated a novel method that can determine both the geometrical thickness and refractive index of a silicon wafer at the same time using an optical comb. The geometrical thickness and refractive index of a silicon wafer was determined from the optical thickness using phase information obtained in the spectral domain. In a feasibility test, the geometrical thickness and refractive index of a wafer were measured to be 334.85 microm and 3.50, respectively. The measurement uncertainty for the geometrical thickness was evaluated as 0.95 microm (k = 1) using a preliminary setup.