Open AccessCompact and passive-alignment 4-channel × 25-Gbps optical interconnect modules based on silicon optical benches with 45° micro-reflectors
Author(s) -
Hsu Liang Hsiao,
Hsiao Chin Lan,
Chia Chi Chang,
Chia Yu Lee,
Siou Ping Chen,
Chih Hung Hsu,
Shuo Chang,
Yo Shen Lin,
F.-M. Kuo,
Jin Shi,
Mount-Learn Wu
Publication year - 2009
Publication title -
optics express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.17.024250
Subject(s) - materials science , vertical cavity surface emitting laser , optical interconnect , optics , optoelectronics , etching (microfabrication) , silicon , coupling loss , interconnection , reflector (photography) , optical fiber , laser , telecommunications , computer science , physics , layer (electronics) , composite material , light source
Compact and passive-alignment 4-channel x 2.5-Gbps optical interconnect modules are developed based on the silicon optical benches (SiOBs) of 5 x 5 mm2. A silicon-based 45 degrees micro-reflector and V-groove arrays are fabricated on the SiOB using anisotropic wet etching. Moreover, high-frequency transmission lines of 4 channel x 2.5 Gbps, and bonding pads with Au/Sn eutectic solder are also deposited on the SiOB. The vertical-cavity surface-emitting laser (VCSEL) array and photo-detector (PD) array are flip-chip assembled on the intended positions. The multi-mode fiber (MMF) ribbons are passively aligned and mounted onto the V-groove arrays. Without the assistance of additional optics, the coupling efficiencies of VCSEL-to-MMF in the transmitting part and MMF-to-PD in the receiving part can be as high as -5.65 and -1.98 dB, respectively, under an optical path of 180 microm. The 1-dB coupling tolerance of greater than +/- 20 microm is achieved for both transmitting and receiving parts. Eye patterns of both parts are demonstrated using 15-bit PRBS at 2.5 Gbps.