Open AccessLayer-to-layer optical interconnect coupling by soft-lithographic stamping
Author(s) -
Wei Ni,
Xingkun Wu,
Jing Cynthia Wu
Publication year - 2009
Publication title -
optics express
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.17.001194
Subject(s) - interconnection , lithography , materials science , fabrication , soft lithography , optical interconnect , coupling (piping) , coupling loss , stamping , optoelectronics , bandwidth (computing) , optics , insertion loss , optical fiber , computer science , telecommunications , medicine , alternative medicine , physics , pathology , metallurgy
We designed and developed a fabrication method for a polymeric waveguide connecting multiple optical interconnect layers in three-dimensional integrated electro-optical systems, using a series of silicone elastomer stamps. The scalable process is a deterministic printing method, generating optical S-shaped polymeric lightwave coupling for interconnects among separate layers. General characteristics of S-shaped coupling among layers with various separation distances were investigated too. The soft-lithography fabrication process of this coupling interconnection design allows for significant advantages over traditional designs and fabrication methods in terms of insertion loss as well as 3D integration capability, when used in high-bandwidth printed circuit boards.