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Chip- and board-level optical interconnections using rigid flexible optical electrical printed circuit boards
Author(s) -
Sung Hwan Hwang,
W. J. Lee,
Jung Woon Lim,
Ki Young Jung,
K. S.,
Byung Sup Rho
Publication year - 2008
Publication title -
optics express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.394
H-Index - 271
ISSN - 1094-4087
DOI - 10.1364/oe.16.008077
Subject(s) - printed circuit board , materials science , interconnection , chip , fabrication , optics , optoelectronics , waveguide , computer science , electrical engineering , telecommunications , engineering , medicine , physics , alternative medicine , pathology
A new optical interconnection scheme based on a rigid flexible optical electrical printed circuit board (RFOE-PCB) is suggested. The easily installed RFOE-PCB can be universally applied for both chip- and board-level optical interconnections. This letter describes the detailed fabrication process, optical properties, and heat-resisting property of the RFOE-PCB. The fabricated RFOE-PCB was also successfully demonstrated with a 2.5-Gb/s data transmission through a 45 degrees-ended optical waveguide embedded in the RFOE-PCB.

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