Chip- and board-level optical interconnections using rigid flexible optical electrical printed circuit boards | Zendy

SungHo Hwang | Zendy; W. J. Lee | Zendy; Jisu Lim | Zendy; KiYoung Jung | Zendy; S. Krishna Prasad | Zendy; Byung Sup Rho | Zendy

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Chip- and board-level optical interconnections using rigid flexible optical electrical printed circuit boards

Author(s) -

SungHo Hwang,

W. J. Lee,

Jisu Lim,

KiYoung Jung,

S. Krishna Prasad,

Byung Sup Rho

Publication year - 2008

Publication title -

optics express

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 1.394

H-Index - 271

ISSN - 1094-4087

DOI - 10.1364/oe.16.008077

Subject(s) - printed circuit board , materials science , interconnection , chip , fabrication , optics , optoelectronics , waveguide , computer science , electrical engineering , telecommunications , engineering , medicine , physics , alternative medicine , pathology

A new optical interconnection scheme based on a rigid flexible optical electrical printed circuit board (RFOE-PCB) is suggested. The easily installed RFOE-PCB can be universally applied for both chip- and board-level optical interconnections. This letter describes the detailed fabrication process, optical properties, and heat-resisting property of the RFOE-PCB. The fabricated RFOE-PCB was also successfully demonstrated with a 2.5-Gb/s data transmission through a 45 degrees-ended optical waveguide embedded in the RFOE-PCB.

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