Open AccessStacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding
Author(s) -
Arne Quellmalz,
Simon Sawallich,
Maximilian Prechtl,
Oliver Hartwig,
Siwei Luo,
Stefan Wagner,
Georg S. Duesberg,
Max C. Lemme,
Frank Niklaus,
Kristinn B. Gylfason
Publication year - 2021
Publication title -
conference on lasers and electro-optics
Language(s) - English
Resource type - Conference proceedings
DOI - 10.1364/cleo_si.2021.sw3f.2
Subject(s) - stacking , wafer , molybdenum disulfide , materials science , heterojunction , wafer bonding , graphene , optoelectronics , semiconductor , photonics , semiconductor device fabrication , molybdenum , nanotechnology , engineering physics , composite material , metallurgy , engineering , chemistry , organic chemistry
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