Open AccessFluid Structure Interaction Numerical Simulation of Wiresweep in Electronics Packaging
Author(s) -
Dadan Ramdan,
Urip Harahap,
Andi Rubiantara,
C. Y. Khor
Publication year - 2016
Publication title -
telkomnika
Language(s) - English
Resource type - Journals
eISSN - 2302-9293
pISSN - 1693-6930
DOI - 10.12928/telkomnika.v14i1.2030
Subject(s) - computer science , volume of fluid method , computational fluid dynamics , visualization , fluid dynamics , computer simulation , finite volume method , electronics , rheology , front (military) , materials science , mechanics , mechanical engineering , flow (mathematics) , simulation , physics , composite material , data mining , engineering , electrical engineering