Open AccessThermal Performance Evaluation of Junction Thermal Bridge according to Installation Position of Window
Author(s) -
Soo-Man Lee,
DongYun Kim,
Jung-Hyuk Ahn,
Jonghwa Eom,
U–Cheul Shin
Publication year - 2017
Publication title -
kieae journal
Language(s) - English
Resource type - Journals
eISSN - 2288-9698
pISSN - 2288-968X
DOI - 10.12813/kieae.2017.17.3.015
Subject(s) - thermal transmittance , window (computing) , transmittance , thermal bridge , thermal , track (disk drive) , materials science , thermal insulation , optics , bridge (graph theory) , structural engineering , thermal resistance , computer science , mechanical engineering , composite material , engineering , optoelectronics , physics , layer (electronics) , meteorology , operating system , medicine