Open AccessThe Optimization of Ball Shear Strength Using a Computational Model
Author(s) -
Joompon Bamrungwong,
Chutima Prasartkaew
Publication year - 2019
Publication title -
destech transactions on engineering and technology research
Language(s) - English
Resource type - Journals
ISSN - 2475-885X
DOI - 10.12783/dtetr/icicr2019/30586
Subject(s) - ball grid array , ball (mathematics) , soldering , printed circuit board , surface mount technology , integrated circuit packaging , finite element method , materials science , contact resistance , shear force , mechanical engineering , structural engineering , composite material , integrated circuit , engineering , electrical engineering , mathematics , mathematical analysis , optoelectronics , layer (electronics)