Open AccessMechanical Properties of Phenolic Foam Modified Insulation Board by Urethane Oligomer
Author(s) -
Yaqi Zhang,
Guozhong Lu,
Weixuan Zhao,
Xuesong Zheng
Publication year - 2019
Publication title -
destech transactions on engineering and technology research
Language(s) - English
Resource type - Journals
ISSN - 2475-885X
DOI - 10.12783/dtetr/icaen201/28988
Subject(s) - materials science , composite material , flexural strength , toughness , microstructure , thermal insulation , oligomer , thermal conductivity , compressive strength , polymer chemistry , layer (electronics)