
Review of Reliability Analysis Based on Degradation Modeling
Author(s) -
Xuepeng Jiang,
Bei Hong,
Chuanbao Jia
Publication year - 2018
Publication title -
destech transactions on computer science and engineering
Language(s) - English
Resource type - Journals
ISSN - 2475-8841
DOI - 10.12783/dtcse/cmee2017/20078
Subject(s) - reliability (semiconductor) , degradation (telecommunications) , reliability engineering , computer science , stress (linguistics) , field (mathematics) , engineering , mathematics , telecommunications , power (physics) , linguistics , physics , philosophy , quantum mechanics , pure mathematics