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THE EFFECT OF TEMPERATURES ON THE TLP DIFFUSION BONDING OF Ni-Ti-Cu COMPOSITES MANUFACTURED BY COLD PRESSING METHOD
Author(s) -
Uğur Çalıgülü,
Mustafa Taşkın,
Haluk Kejanlı
Publication year - 2008
Publication title -
dergipark (istanbul university)
Language(s) - English
DOI - 10.12739/nwsaes.v3i4.5000067174
Subject(s) - diffusion bonding , materials science , pressing , composite material , diffusion , copper , metallurgy , physics , thermodynamics

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