z-logo
open-access-imgOpen Access
Lithography-Based Surface Modification of Copper for Soldering Application
Author(s) -
Nurul Aida Husna Mohd Mahayuddin,
Juyana A. Wahab,
Muhammad Ainzulhafiz Mat Salleh,
Muhammad Firdaus Mohd Nazeri,
P. Postawa,
M. Nabiałek,
B. Jeż,
J. Garus
Publication year - 2022
Publication title -
acta physica polonica a
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.217
H-Index - 38
eISSN - 1898-794X
pISSN - 0587-4246
DOI - 10.12693/aphyspola.142.74
Subject(s) - soldering , copper , materials science , lithography , surface modification , surface (topology) , nanotechnology , metallurgy , optoelectronics , mechanical engineering , engineering , geometry , mathematics

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here
Accelerating Research

Address

John Eccles House
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom