Lithography-Based Surface Modification of Copper for Soldering Application
Author(s) -
Nurul Aida Husna Mohd Mahayuddin,
Juyana A. Wahab,
Muhammad Ainzulhafiz Mat Salleh,
Muhammad Firdaus Mohd Nazeri,
P. Postawa,
M. Nabiałek,
B. Jeż,
J. Garus
Publication year - 2022
Publication title -
acta physica polonica a
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.217
H-Index - 38
eISSN - 1898-794X
pISSN - 0587-4246
DOI - 10.12693/aphyspola.142.74
Subject(s) - soldering , copper , materials science , lithography , surface modification , surface (topology) , nanotechnology , metallurgy , optoelectronics , mechanical engineering , engineering , geometry , mathematics
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