Open AccessThe 56xx Desktop Micro Factory - the New Equipment for Wire-Bond Technologies
Author(s) -
Josef Sedlmair,
Simon Berger
Publication year - 2009
Publication title -
acta physica polonica. a
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.217
H-Index - 38
eISSN - 1898-794X
pISSN - 0587-4246
DOI - 10.12693/aphyspola.116.s-196
Subject(s) - factory (object oriented programming) , bond , materials science , manufacturing engineering , wire bonding , computer science , telecommunications , business , engineering , finance , programming language , chip