Open AccessResearch about Thermal Fatigue Characteristic of IGBT Module in Considering of Electro-Thermal-Mechanism Coupling and Crack
Author(s) -
翔宇 陈
Publication year - 2017
Publication title -
smart grid
Language(s) - English
Resource type - Journals
eISSN - 2161-8771
pISSN - 2161-8763
DOI - 10.12677/sg.2017.76049
Subject(s) - materials science , mechanism (biology) , insulated gate bipolar transistor , failure mechanism , coupling (piping) , thermal , thermal fatigue , composite material , structural engineering , electrical engineering , engineering , voltage , physics , thermodynamics , quantum mechanics