Open AccessResearch of Packaging Technology on SiC Power Devices under High Temperature and High Voltage
Publication year - 2014
Publication title -
smart grid
Language(s) - English
Resource type - Journals
eISSN - 2161-8771
pISSN - 2161-8763
DOI - 10.12677/sg.2014.46035
Subject(s) - materials science , high voltage , engineering physics , electrical engineering , optoelectronics , power (physics) , silicon carbide , voltage , engineering , composite material , physics , quantum mechanics