Open AccessElectromigration in Lead-Free Solder and Its Avoidance
Author(s) -
积超 蒋
Publication year - 2013
Publication title -
open journal of natural science
Language(s) - English
Resource type - Journals
eISSN - 2330-1724
pISSN - 2330-1732
DOI - 10.12677/ojns.2013.11001
Subject(s) - electromigration , lead (geology) , soldering , geology , forensic engineering , materials science , metallurgy , engineering , composite material , geomorphology
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