Open AccessEffect of Tellurium on Copper Electrodeposition in Copper Sulfate-Sulfuric Acid System
Author(s) -
超超 李
Publication year - 2016
Publication title -
ye jin gong cheng
Language(s) - English
Resource type - Journals
eISSN - 2373-1478
pISSN - 2373-1486
DOI - 10.12677/meng.2016.32010
Subject(s) - copper , sulfuric acid , tellurium , copper sulfate , sulfate , chemistry , copper plating , inorganic chemistry , metallurgy , materials science , electroplating , organic chemistry , layer (electronics)