
Algorithm for Wafer Slicing Based on Improved Template Matching
Author(s) -
晨舒 高
Publication year - 2017
Publication title -
tu xiang yu xin hao chu li
Language(s) - English
Resource type - Journals
eISSN - 2325-6745
pISSN - 2325-6753
DOI - 10.12677/jisp.2017.63017
Subject(s) - slicing , wafer , computer science , matching (statistics) , template matching , program slicing , artificial intelligence , materials science , nanotechnology , mathematics , computer graphics (images) , statistics , image (mathematics)