Open AccessEffect of Density of Interfacial Defect on Mechanical Properties of Copper Nanowires
Author(s) -
宋 海洋
Publication year - 2014
Publication title -
ying yong wi li/ying yong wu li
Language(s) - English
Resource type - Journals
eISSN - 2160-7567
pISSN - 2160-7575
DOI - 10.12677/app.2014.412024
Subject(s) - copper , nanowire , materials science , copper wire , nanotechnology , composite material , metallurgy