Open AccessImmersed Interface Method for Elliptic Interface and Heat Conduction Problem
Author(s) -
利平 张
Publication year - 2015
Publication title -
advances in applied mathematics
Language(s) - English
Resource type - Journals
eISSN - 2324-7991
pISSN - 2324-8009
DOI - 10.12677/aam.2015.42019
Subject(s) - interface (matter) , thermal conduction , materials science , mechanics , physics , composite material , capillary number , capillary action
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