Open AccessAdvanced packaging methods for high-power LED modules
Author(s) -
R. Jordan,
Constanze Weber,
Christian Ehrhardt,
Martin Wilke,
Johannes Jaeschke
Publication year - 2015
Publication title -
journal of solid state lighting
Language(s) - Uncategorized
Resource type - Journals
ISSN - 2196-1107
DOI - 10.1186/s40539-015-0023-z
Subject(s) - interconnection , soldering , thermal management of electronic devices and systems , dissipation , computer science , electronic packaging , transient (computer programming) , power (physics) , power module , materials science , mechanical engineering , electronic engineering , engineering , telecommunications , physics , quantum mechanics , composite material , thermodynamics , operating system