Open AccessEffects of deep reactive ion etching parameters on etching rate and surface morphology in extremely deep silicon etch process with high aspect ratio
Author(s) -
Tiantong Xu,
Zhi Tao,
Hanqing Li,
Xiao Tan,
Haiwang Li
Publication year - 2017
Publication title -
advances in mechanical engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.318
H-Index - 40
eISSN - 1687-8140
pISSN - 1687-8132
DOI - 10.1177/1687814017738152
Subject(s) - etching (microfabrication) , materials science , deep reactive ion etching , aspect ratio (aeronautics) , surface roughness , reactive ion etching , silicon , surface finish , passivation , microelectromechanical systems , volumetric flow rate , morphology (biology) , profilometer , optoelectronics , nanotechnology , composite material , layer (electronics) , mechanics , physics , biology , genetics
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