Dynamic Dielectric Analysis for Nondestructive Cure Monitoring and Process Control
Author(s) -
David E. Kranbuehl,
P. Haverty,
M. Hoff,
Ray D. Hoffman,
J. Godfrey
Publication year - 1989
Publication title -
journal of reinforced plastics and composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.678
H-Index - 64
eISSN - 1530-7964
pISSN - 0731-6844
DOI - 10.1177/073168448900800501
Subject(s) - thermosetting polymer , materials science , epoxy , composite material , polyester , dielectric , viscosity , process (computing) , inert , polyester resin , computer science , optoelectronics , physics , quantum mechanics , operating system
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