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Dielectric properties of sawdust reinforced epoxy composites post-cured in microwaves
Author(s) -
H. Ku,
M. Trada,
Pei Tai
Publication year - 2013
Publication title -
journal of reinforced plastics and composites
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.678
H-Index - 64
eISSN - 1530-7964
pISSN - 0731-6844
DOI - 10.1177/0731684412475250
Subject(s) - materials science , composite material , sawdust , dielectric , epoxy , dissipation factor , composite number , glass transition , microwave , dielectric loss , dynamic mechanical analysis , microwave oven , modulus , young's modulus , polymer , ecology , physics , optoelectronics , quantum mechanics , biology
This study focuses on the measurement and evaluation of dielectric properties of composite materials with a view to benefiting these relevant industries. Previously published, have been the mechanical and thermal properties of sawdust reinforced epoxy composites. The properties of a dielectric material can be controlled through the introduction of various fillers. This study was primarily undertaken to determine the effect of sawdust on the dielectric properties of the composites. The original contribution of this paper states that samples post-cured in microwaves have higher dielectric constant values but lower loss tangent values than their counterparts post-cured in an oven. For all percentages by weight of sawdust, the glass transition temperature for the microwave-cured samples was lower and the composite was softer; the opposite was true for the oven cured sample. In addition, the storage modulus of all samples post-cured in microwaves is also lower than their counterparts. This is in line with the fact that it is a softer material and has lower storage modulus and lower glass transition temperature.

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