Adhesion problematics and curing kinetics in a thermosetting matrix for stitch-free non-crimp fabric
Author(s) -
Iris Kruppke,
RolfDieter Hund,
Chokri Cherif
Publication year - 2015
Publication title -
textile research journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.43
H-Index - 84
eISSN - 1746-7748
pISSN - 0040-5175
DOI - 10.1177/0040517515612360
Subject(s) - materials science , composite material , thermosetting polymer , epoxy , adhesive , curing (chemistry) , crimp , differential scanning calorimetry , thermoplastic , layer (electronics) , thermodynamics , physics
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom