Open AccessStudy on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials
Author(s) -
Feng Guo
Publication year - 2016
Publication title -
science discovery
Language(s) - English
Resource type - Journals
eISSN - 2331-0650
pISSN - 2331-0642
DOI - 10.11648/j.sd.20160401.20
Subject(s) - coating , materials science , brittleness , curing (chemistry) , composite material , layer (electronics)