
Wireless power transfer through metal using inductive link
Author(s) -
Truong V. Vu,
Chi Van Pham,
AnhVu Pham,
Christopher S. Gardner
Publication year - 2019
Publication title -
international journal of power electronics and drive systems (ijpeds)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.322
H-Index - 21
ISSN - 2088-8694
DOI - 10.11591/ijpeds.v10.i4.pp1906-1913
Subject(s) - font , maximum power transfer theorem , amplifier , wireless power transfer , span (engineering) , transfer (computing) , power (physics) , electrical engineering , computer science , optics , materials science , physics , telecommunications , wireless , artificial intelligence , engineering , bandwidth (computing) , structural engineering , quantum mechanics , parallel computing
This paper presents a highly efficient power transfer system based on a co-design of a class-E power amplifier (PA) and a pair of inductively coupled Helical coils for through-metal-wall power transfer. Power is transferred wirelessly through a 3.1-mm thick aluminum barrier without any physical penetration and contact. Measurement results show that the class-E PA achieves a peak power gain of 25.2 dB and a maximum collector efficiency of 57.3%, all at 200 Hz. The proposed system obtains a maximum power transfer efficiency of 9% and it can deliver 5 W power to the receiver side through the aluminum barrier.