Considerations in Formulation and Manufacturing of Thick Film Inks
Author(s) -
Adrian Rose
Publication year - 1981
Publication title -
active and passive electronic components
Language(s) - English
Resource type - Journals
eISSN - 1026-7034
pISSN - 0882-7516
DOI - 10.1155/apec.9.43
Subject(s) - process engineering , materials science , engineering drawing , computer science , engineering
This paper discusses considerations in formulation and manufacture of thick film inks. It deals with the components of thick film inks, their properties, functions, and manufacturing methods. The vehicle is defined and its components are discussed in terms of function, properties, and types. The various types of metals and their important properties are described and related to ink properties. Glass functions, types and properties are reviewed. Both vitreous and devitrifying glasses are examined. The usage of various types of oxides is discussed. Typical thick film inks are described. They include conductor, resistor, dielectric inks, and protective coatings. The types of components used are related to specific property requirements of each type of material. Ink manufacturing methods are described. Preparation of vehicle, metal powder, and glass frit is discussed. The process of incorporating these materials into an ink is detailed from initial mixing to final product. Testing, both in-process and final Q.C., is briefly discussed. The important considerations in both formulation and manufacturing are identified.
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